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Website:www.diodes.com
country/region:USA
Application:
5G and communication networksconsumer electronicsAutomotive electronicscomputer
Diodes' products include diodes, rectifiers, transistors, MOSFETs, protection devices, function-specific arrays, amplifiers and comparators, Hall effect sensors and temperature sensors, power management devices including LED drivers, DC-DC power switching regulators, Linear regulators and voltage references, as well as a variety of special function devices including USB power switches, load switches, voltage monitors and motor controllers.
Change:Additional Wafer Source
No.:PCN-2685
Description:Qualification of Additional Wafer Source for Select Discrete Products
Change:Additional Wafer Source
No.:PCN-2685
Description:Qualification of Additional Wafer Source for Select Discrete Products
Change:Cu Pillar Bump Optimization
No.:PCN-2680
Description:Qualified Bill of Material (BOM) - Cu Pillar Bump Optimization.
Change:Cu Pillar Bump Optimization
No.:PCN-2680
Description:Qualified Bill of Material (BOM) - Cu Pillar Bump Optimization.
Change:Cu Pillar Bump Optimization
No.:PCN-2680
Description:Qualified Bill of Material (BOM) - Cu Pillar Bump Optimization.
Change:Assembly Bill of Materials
No.:PCN-2673
Description:Lead Frame and Mold Compound changes to enhance select GBU and GBJ packaged products
Change:Assembly Bill of Materials
No.:PCN-2673
Description:Lead Frame and Mold Compound changes to enhance select GBU and GBJ packaged products
Change:Assembly Bill of Materials
No.:PCN-2673
Description:Lead Frame and Mold Compound changes to enhance select GBU and GBJ packaged products
Change:Assembly Bill of Materials
No.:PCN-2673
Description:Lead Frame and Mold Compound changes to enhance select GBU and GBJ packaged products
Change:Assembly Bill of Materials
No.:PCN-2673
Description:Lead Frame and Mold Compound changes to enhance select GBU and GBJ packaged products
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