Change:Assembly Bill of Materials
No.:PCN-2673
Description:Lead Frame and Mold Compound changes to enhance select GBU and GBJ packaged products
Change:Assembly Bill of Materials
No.:PCN-2673
Description:Lead Frame and Mold Compound changes to enhance select GBU and GBJ packaged products
Change:Assembly Bill of Materials
No.:PCN-2673
Description:Lead Frame and Mold Compound changes to enhance select GBU and GBJ packaged products
Change:Assembly Bill of Materials
No.:PCN-2673
Description:Lead Frame and Mold Compound changes to enhance select GBU and GBJ packaged products
Change:Additional Wafer Source
No.:PCN-2679
Description:Qualification of Additional Wafer Source for Select Discrete Products
Change:Additional Wafer Source
No.:PCN-2679
Description:Qualification of Additional Wafer Source for Select Discrete Products
Change:Additional Wafer Source
No.:PCN-2679
Description:Qualification of Additional Wafer Source for Select Discrete Products
Change:Additional Wafer Source
No.:PCN-2679
Description:Qualification of Additional Wafer Source for Select Discrete Products
Change:Additional Wafer Source
No.:PCN-2679
Description:Qualification of Additional Wafer Source for Select Discrete Products
Change:Additional Wafer Source
No.:PCN-2679
Description:Qualification of Additional Wafer Source for Select Discrete Products