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变更类型:Assembly Site,Materials,Wafer Site
变更编号:IPCN25255X
变更说明:Qualification of Minigates Vanguard die in uDFN6/8 Package
变更类型:Materials,Wafer Site
变更编号:IPCN25286X
变更说明:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.
变更类型:Materials
变更编号:IPCN25344X
变更说明:Those affected OPNs change bonding wire from Gold to Palladium Coated Copper (PCC) wire interconnect.
变更类型:Materials
变更编号:IPCN25344X
变更说明:Those affected OPNs change bonding wire from Gold to Palladium Coated Copper (PCC) wire interconnect.
变更类型:Assembly Site,Materials,Test Site
变更编号:IPCN25366X
变更说明:TO-220-IC 5LD Assembly and Test Qualification to JCET Semiconductor (Suqian) Co.Ltd.
变更类型:Wafer Site
变更编号:IPCN25373X
变更说明:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
变更类型:Wafer Site
变更编号:IPCN25373X
变更说明:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
变更类型:Marking Molding,Wafer Site
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Marking Molding,Wafer Site
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Assembly Site,Materials,Test Site,Wafer Site
变更编号:IPCN25390X
变更说明:This IPCN was issued to qualify new die source in Taiwan for 3V Minigates and standardize the assembly and test site to increase the front end and back-end capacity and standardizing materials.
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