变更类型:Materials,Wafer Site
变更编号:IPCN25451X
变更说明:Qualification of onsemi Aizu Japan as wafer Fab for ONC25 Technology.
变更类型:Materials,Wafer Site
变更编号:IPCN25451X
变更说明:Qualification of onsemi Aizu Japan as wafer Fab for ONC25 Technology.
变更类型:Assembly Site,Materials,Test Site
变更编号:FPCN25132X
变更说明:TO247 Assembly and Test Qualification of Shantou Huashan (SHEDCL), China for capacity expansion.
变更类型:Assembly Site,Materials,Test Site
变更编号:FPCN25132X
变更说明:TO247 Assembly and Test Qualification of Shantou Huashan (SHEDCL), China for capacity expansion.
变更类型:Wafer Process
变更编号:FPCN24945XB
变更说明:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
变更类型:Wafer Process
变更编号:FPCN24945XB
变更说明:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
变更类型:Wafer Process
变更编号:FPCN24945XB
变更说明:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
变更类型:Wafer Process
变更编号:FPCN24945XB
变更说明:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
变更类型:Assembly Site,Materials,Test Site
变更编号:FPCN25132X
变更说明:TO247 Assembly and Test Qualification of Shantou Huashan (SHEDCL), China for capacity expansion.
变更类型:Assembly Process
变更编号:IPCN25057X
变更说明:Qualify 2nd source glass supplier PTOT at ASEM.