变更类型:Assembly Site,Materials,Product Code,Wafer Site
变更编号:IPCN25255X
变更说明:Qualification of Minigates Vanguard die in uDFN6/8 Package
变更类型:Assembly Site,Materials,Packing
变更编号:IPCN25336X
变更说明:Qualification Assembly site in UTAC Thailand
变更类型:Wafer Site
变更编号:IPCN25373X
变更说明:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
变更类型:Materials,Wafer Site
变更编号:IPCN25451X
变更说明:Qualification of onsemi Aizu Japan as wafer Fab for ONC25 Technology.
变更类型:Materials,Wafer Site
变更编号:IPCN25451Z
变更说明:Qualification of onsemi Aizu Japan as wafer Fab for ONC25 Technology.
变更类型:Assembly Process
变更编号:IPCN25057X
变更说明:Qualify 2nd source glass supplier PTOT at ASEM.
变更类型:Materials,Wafer Site
变更编号:IPCN25286X
变更说明:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.
变更类型:Wafer Process,Wafer Site
变更编号:IPCN25297Z
变更说明:Transfer wafer fabrication from Gresham to Aizu for NCD570x family of gate driver products.
变更类型:Assembly Site,Marking Molding,Test Site,Wafer Site
变更编号:IPCN25300Z1
变更说明:Updated document, Reason of update: Update to IPCN25300Z - To remove the JS Foundry, Japan in Before and After change table.
变更类型:Materials
变更编号:IPCN25344X
变更说明:Those affected OPNs change bonding wire from Gold to Palladium Coated Copper (PCC) wire interconnect.