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变更类型:Wafer Process
变更编号:FPCN24945XB
变更说明:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
变更类型:Assembly Site,Materials,Test Site
变更编号:FPCN25132X
变更说明:TO247 Assembly and Test Qualification of Shantou Huashan (SHEDCL), China for capacity expansion.
变更类型:Assembly Site,Materials,Product Code,Wafer Site
变更编号:IPCN25255X
变更说明:Qualification of Minigates Vanguard die in uDFN6/8 Package
变更类型:Assembly Site,Materials,Wafer Site
变更编号:IPCN25255X
变更说明:Qualification of Minigates Vanguard die in uDFN6/8 Package
变更类型:Assembly Site,Materials,Product Code,Wafer Site
变更编号:IPCN25255X
变更说明:Qualification of Minigates Vanguard die in uDFN6/8 Package
变更类型:Assembly Site,Materials,Product Code,Wafer Site
变更编号:IPCN25255X
变更说明:Qualification of Minigates Vanguard die in uDFN6/8 Package
变更类型:Assembly Site,Materials,Product Code,Wafer Site
变更编号:IPCN25255Z
变更说明:Qualification of Minigates Vanguard die in uDFN6/8 Package
变更类型:Materials,Wafer Site
变更编号:IPCN25286X
变更说明:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.
变更类型:Materials,Wafer Site
变更编号:IPCN25286X
变更说明:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.
变更类型:Materials,Wafer Site
变更编号:IPCN25286X
变更说明:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.
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