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ON Semiconductor 是高能效电子产品领域的技术创新推动者，能让设计工程师减少全球能源使用。 公司提供种类全面的产品组合，具体包括高能效电源和信号管理、逻辑、分立和定制解决方案，能帮助客户解决在汽车、通信、计算、消费电子、工业、LED 照明、医疗、军事/航空航天和电源应用方面的独特设计难题。
变更类型:Materials,Wafer Site
变更编号:IPCN25286X
变更说明:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.
变更类型:Wafer Site
变更编号:IPCN25373X
变更说明:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
变更类型:Wafer Site
变更编号:IPCN25373X
变更说明:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
变更类型:Wafer Site
变更编号:IPCN25373X
变更说明:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
变更类型:Wafer Site
变更编号:IPCN25373X
变更说明:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
变更类型:Marking Molding,Wafer Site
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Marking Molding,Wafer Site
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Marking Molding,Wafer Site
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Assembly Site,Materials,Test Site,Wafer Site
变更编号:IPCN25390X
变更说明:This IPCN was issued to qualify new die source in Taiwan for 3V Minigates and standardize the assembly and test site to increase the front end and back-end capacity and standardizing materials.
变更类型:Assembly Site,Materials,Test Site,Wafer Site
变更编号:IPCN25390X
变更说明:This IPCN was issued to qualify new die source in Taiwan for 3V Minigates and standardize the assembly and test site to increase the front end and back-end capacity and standardizing materials.
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