Change:
No.:PCN_FT_006
Description:Silicon modifications have resulted in the device being updated to Revision B
Change:
No.:PCN_FT_006
Description:Silicon modifications have resulted in the device being updated to Revision B
Change:
No.:PCN_FT_006
Description:Silicon modifications have resulted in the device being updated to Revision B
Change:
No.:PCN_FT_005
Description:Silicon modifications have resulted in the device being modified to Revision C
Change:
No.:PCN_FT_005
Description:Silicon modifications have resulted in the device being modified to Revision C
Change:
No.:PCN_FT_005
Description:Silicon modifications have resulted in the device being modified to Revision C
Change:
No.:PCN_FT_005
Description:Silicon modifications have resulted in the device being modified to Revision C
Change:Marking Molding,Materials,Software Change
No.:00001
Description:Metal layer change to wafer mask set
Change:Marking Molding,Materials,Software Change
No.:00001
Description:Metal layer change to wafer mask set
Change:Marking Molding,Materials,Software Change
No.:00001
Description:Metal layer change to wafer mask set