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FTDI(飞特帝亚)
country/region:U.K.
Application:
Industrial applicationssmart homeconsumer electronicsmedicalPower and energyAutomotive electronics5G and communication networks

FTDI Chip develops innovative silicon solutions that leverage the latest technologies for enhanced interactivity. Guided by the philosophy of "designed to create simplicity," the company is able to support engineers with highly complex, feature-rich, rugged and simple-to-use product platforms. FTDI Chip has a long history of growing its Universal Serial Bus (USB) product line and has some of the most recognized products in the world. The company's Embedded Video Engine (EVE) graphics controller packages display, audio and touch functionality in a single chip, significantly reducing development time and bill of materials costs required for human-machine interface (HMI) implementations. FTDI Chip also offers a family of highly differentiated, speed-optimized microcontrollers that further enhance connectivity capabilities. FTDI Chip is a fabless semiconductor company headquartered in Glasgow, UK, with R&D facilities in Glasgow, Singapore and Taipei (Taiwan, China), and regional sales in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China) and technical support department.

Type:PCN
Time:2010-08-19
Change:
No.:PCN_FT_006
Description:Silicon modifications have resulted in the device being updated to Revision B
Type:PCN
Time:2010-08-19
Change:
No.:PCN_FT_006
Description:Silicon modifications have resulted in the device being updated to Revision B
Type:PCN
Time:2010-08-19
Change:
No.:PCN_FT_006
Description:Silicon modifications have resulted in the device being updated to Revision B
Model:FT4232HQ
Type:PCN
Time:2010-04-15
Change:
No.:PCN_FT_005
Description:Silicon modifications have resulted in the device being modified to Revision C
Model:FT2232HQ
Type:PCN
Time:2010-04-15
Change:
No.:PCN_FT_005
Description:Silicon modifications have resulted in the device being modified to Revision C
Model:FT2232HL
Type:PCN
Time:2010-04-15
Change:
No.:PCN_FT_005
Description:Silicon modifications have resulted in the device being modified to Revision C
Model:FT4232HL
Type:PCN
Time:2010-04-15
Change:
No.:PCN_FT_005
Description:Silicon modifications have resulted in the device being modified to Revision C
Model:FT232RL
Type:PCN
Time:2008-01-30
Change:Marking Molding,Materials,Software Change
No.:00001
Description:Metal layer change to wafer mask set
Model:FT232RQ
Type:PCN
Time:2008-01-30
Change:Marking Molding,Materials,Software Change
No.:00001
Description:Metal layer change to wafer mask set
Model:FT245RQ
Type:PCN
Time:2008-01-30
Change:Marking Molding,Materials,Software Change
No.:00001
Description:Metal layer change to wafer mask set
RFQ
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