Change:Marking Molding,Materials,Software Change
No.:00001
Description:Metal layer change to wafer mask set
Change:
No.:PCN 00001
Description:Metal layer change to the wafer mask set
Change:
No.:PCN 00001
Description:Metal layer change to the wafer mask set
Change:
No.:PCN 00001
Description:Metal layer change to the wafer mask set
Change:
No.:PCN 00001
Description:Metal layer change to the wafer mask set
Change:Assembly Process,Datasheet Specifications,Marking Molding,Product Code
No.:00002
Description:Replaced by FT2232D,Improve noise immunity on USB transceiver,Enable CPU target mode
Change:Assembly Process,Datasheet Specifications,Marking Molding,Product Code
No.:00002
Description:Replaced by FT2232D,Improve noise immunity on USB transceiver,Enable CPU target mode
Change:
No.:PCN 00002
Description:Replaced by FT2232D
Change:
No.:PCN 00002
Description:Replaced by FT2232D