Change:Wafer Process
No.:FPCN24945XB
Description:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
Change:Assembly Site,Materials,Test Site
No.:FPCN25132X
Description:TO247 Assembly and Test Qualification of Shantou Huashan (SHEDCL), China for capacity expansion.
Change:Assembly Site,Materials,Product Code,Wafer Site
No.:IPCN25255X
Description:Qualification of Minigates Vanguard die in uDFN6/8 Package
Change:Assembly Site,Materials,Wafer Site
No.:IPCN25255X
Description:Qualification of Minigates Vanguard die in uDFN6/8 Package
Change:Assembly Site,Materials,Product Code,Wafer Site
No.:IPCN25255X
Description:Qualification of Minigates Vanguard die in uDFN6/8 Package
Change:Assembly Site,Materials,Product Code,Wafer Site
No.:IPCN25255X
Description:Qualification of Minigates Vanguard die in uDFN6/8 Package
Change:Assembly Site,Materials,Product Code,Wafer Site
No.:IPCN25255Z
Description:Qualification of Minigates Vanguard die in uDFN6/8 Package
Change:Materials,Wafer Site
No.:IPCN25286X
Description:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.
Change:Materials,Wafer Site
No.:IPCN25286X
Description:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.
Change:Materials,Wafer Site
No.:IPCN25286X
Description:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.