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Website:www.onsemi.cn
country/region:USA
Application:
5G and communication networksconsumer electronicsIndustrial applicationsAutomotive electronicsPower and energyAerospaceillumination
ON Semiconductor is a driver of technology innovation in energy-efficient electronics, enabling design engineers to reduce global energy use. The company offers a comprehensive product portfolio of energy-efficient power and signal management, logic, discrete and custom solutions that help customers solve problems in automotive, communications, computing, consumer electronics, industrial, LED lighting, medical, military/aerospace and unique design challenges in power supply applications.
Change:Materials,Wafer Site
No.:IPCN25286X
Description:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.
Change:Wafer Site
No.:IPCN25373X
Description:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
Change:Wafer Site
No.:IPCN25373X
Description:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
Change:Wafer Site
No.:IPCN25373X
Description:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
Change:Wafer Site
No.:IPCN25373X
Description:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
Change:Marking Molding,Wafer Site
No.:IPCN25380X
Description:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
Change:Marking Molding,Wafer Site
No.:IPCN25380X
Description:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
Change:Marking Molding,Wafer Site
No.:IPCN25380X
Description:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
Change:Assembly Site,Materials,Test Site,Wafer Site
No.:IPCN25390X
Description:This IPCN was issued to qualify new die source in Taiwan for 3V Minigates and standardize the assembly and test site to increase the front end and back-end capacity and standardizing materials.
Change:Assembly Site,Materials,Test Site,Wafer Site
No.:IPCN25390X
Description:This IPCN was issued to qualify new die source in Taiwan for 3V Minigates and standardize the assembly and test site to increase the front end and back-end capacity and standardizing materials.
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