变更类型:
变更编号:PCN_FT_008
变更说明:The present Rev-B of this device will be replaced by Rev-C of the device.
变更类型:
变更编号:PCN_FT_008
变更说明:The present Rev-B of this device will be replaced by Rev-C of the device.
变更类型:
变更编号:PCN_FT_008
变更说明:The present Rev-B of this device will be replaced by Rev-C of the device.
变更类型:Assembly Process,Marking Molding,Product Code
变更编号:PCN_FT_007
变更说明:The mini modules PCB have been redesigned to accept the equivalent FT2232H and the FT4232H LQFP package rather than the existing QFN package,A ground test point has been added to aid debug,The PCB is now at Revision 1.1
变更类型:Assembly Process,Marking Molding,Product Code
变更编号:PCN_FT_007
变更说明:The mini modules PCB have been redesigned to accept the equivalent FT2232H and the FT4232H LQFP package rather than the existing QFN package,A ground test point has been added to aid debug,The PCB is now at Revision 1.1
变更类型:
变更编号:PCN_FT_007
变更说明:Modules have been redesigned to use the LQFP package, replacing the QFN package.
变更类型:
变更编号:PCN_FT_007
变更说明:Modules have been redesigned to use the LQFP package, replacing the QFN package.
变更类型:
变更编号:PCN_FT_006
变更说明:Silicon modifications have resulted in the device being updated to Revision B
变更类型:
变更编号:PCN_FT_006
变更说明:Silicon modifications have resulted in the device being updated to Revision B
变更类型:
变更编号:PCN_FT_006
变更说明:Silicon modifications have resulted in the device being updated to Revision B